Changelog
0.4.1, 2026-11-02
Every part has 3D.
- The main board's 17 components are parts in the model. Module, chips, LEDs, mics, switches and connectors are each their own STEP and GLB and their own node under
part:main-pcbain the product models, so a viewer can show the whole board or one chip. Positions follow the stack-up; the small ICs now sit in one row on the underside. - Packaging has 3D: retail box, pulp tray, cable and quick start card.
model/plus-one-packed.glblays out what ships, andmedia/renders/plus-one-packed.pngshows it. - The Plus One+ add-ons (light sensor, NFC tag, debug pads) have STEP and GLB at their footprints. They stay out of the Core models.
- All of these are envelopes: stand-in shapes at the target size, made up to show each part until real CAD exists. Their
geometry.fidelityisenvelopeand every value about them is stillinferred, low confidence.
0.4.0, 2026-11-02
The line follows volume, and the approved size direction.
- Layouts by volume (decision 25; nplusonelabs/factory #21 at 9bc6753). Three new variants:
- A one-technician bench cell for the first 100 builder units, now the recommended layout.
- A two-person U cell for about 2,000 to 4,500 a month.
- A seven-person balanced line on the MadeCell base (decision 24) for about 10,000 a month.
line/layouts/holds the three layout files and a README.media/line/yamazumi-by-volume.svgcharts station times against takt. Capacities are simulated from assumed values, uncalibrated; takts come from the assumed demand.- Battery tug check 3 N, up from 2 N. In the factory simulation a 2 N tug let half-seated plugs through. The operation, the control plan and the PFMEA row are updated.
- Station equipment follows the factory build spec. S1 gets a hot-air cold staker with six nozzles and a punch-travel monitor. S3 gets a torque arm and a screw presenter. S7 gets an acoustic box at 94 dB SPL, 1 kHz, and a six-face tilt table.
- Approved size direction: about 55.4 mm across and at most 12 mm thick. This replaces 57 x 9.5 mm in the design targets. The CAD, the magnet ring, the lugs and
plus-one-base@1still need rework, so they're unchanged here. - New sources: the factory engine, the layout study, decisions 24 and 25, and the dimension direction.
0.3.1, 2026-11-02
Moves to OPD 0.5.0. Trust level claimed, the new name for draft. No values changed.
0.3.0, 2026-11-01
Accessories.
accessories/: a README for builders,interface.yamlwith the base as an interface (plus-one-base@1), a catalog of five first-party accessories and the free printables, a printable fit gauge, a flat back template, the steel ring, and a parametric template script.- The rim now has three windows that expose the lugs, so a back's hooks can twist under them without adding thickness or width. The key slot is an arc, so the key guides the twist.
- Proposed: a pad pinout (PWR, SDA, GND, SCL, ID) and a 1-Wire accessory ID record.
0.2.0, 2026-11-01
Generation one, per decision 20.
- Phone-ring size: about 57 mm across and 9.5 mm thick, down from 58 x 19 mm. The cell, module, speaker and haptic now sit side by side under the board. The stack-up is in the design brief, with 8 mm left as an open question.
- One base, any back. The base carries a magnet ring, three twist-lock lugs inside the rim, an alignment key and five pogo pads outside the charging coil. The two base magnets and the flat foot back are gone; nothing ships attached.
- Wireless charging on every unit: a receiver, coil and ferrite inside the magnet ring. The cell is about 150 mAh (target).
- S6 now bonds the magnet ring and places the coil and pads. S8 tests wireless charging and packs no back. S8 is 56 s against a 60 s takt.
- New PFMEA rows for ring polarity, coil offset and recessed pads. New design targets for magnetic hold and lug pull-out.
- A wearable generation two (about 40 to 44 mm) is noted as what's next, outside this OPD.
0.1.0, 2026-11-01
First release of the Plus One OPD. OPD 0.4.0, trust level draft, prototype in design.
- Card, build card and design brief.
- 37 parts with STEP and GLB CAD for every mechanical part, an assembled and an exploded model, and a USD scene.
- BOM without prices, likely suppliers, electronics detail.
- 19 operations on an 8-station line, with SOPs, sampling plans, 14 tests and a control plan.
- 10 PFMEA rows, three of them carried over from the EC-1 lessons.
- A variant study: splitting S8, and Plus One+ and Plus One++ as coming next.
- A draft device model under proposal 0001.