benikigai/ec-1Public

EC-1 Wireless Controller

Synthetic example. Every value is made up to show the format.

Product · Supply

Supply

Who makes each part, and where?

9
suppliers
23
BOM items with a supplier
5
regions
SupplierRegionSupplies
Shell moulder, from tool marks and cavity numbering
InferredEngineering judgement, not measured. Low confidence.No evidence listed.

sup:shell-moulder
Dongguan, CN
InferredEngineering judgement, not measured. Low confidence.No evidence listed.
Top shell, LED light pipe, Face button cap ×4, Shoulder button ×2, Bottom shell
EMS for SMT and the PCBA (fictional)
InferredEngineering judgement, not measured. Low confidence.No evidence listed.

sup:ems
Shenzhen, CN
InferredEngineering judgement, not measured. Low confidence.No evidence listed.
Main PCBA, Bare board, 4 layers
Stick module vendor, from the module marking EXS-10K
InferredEngineering judgement, not measured. Medium confidence.No evidence listed.

sup:stick-vendor
Guangdong, CN
InferredEngineering judgement, not measured. Medium confidence.No evidence listed.
Analog stick module
Cell maker, from the cell label
InferredEngineering judgement, not measured. Medium confidence.No evidence listed.

sup:cell-maker
Huizhou, CN
ObservedSeen directly: teardown, markings, photos. Medium confidence.No evidence listed.
Li-ion pouch cell, 600 mAh
LRA vendor
InferredEngineering judgement, not measured. Low confidence.No evidence listed.

sup:haptic-vendor
unknown
InferredEngineering judgement, not measured. Low confidence.No evidence listed.
Haptic LRA, 10 mm
Fastener house
InferredEngineering judgement, not measured. Low confidence.No evidence listed.

sup:fastener
Dongguan, CN
InferredEngineering judgement, not measured. Low confidence.No evidence listed.
Screw, M2 x 6, pan head, self-tapping for plastic ×4
Silicone moulder
InferredEngineering judgement, not measured. Low confidence.No evidence listed.

sup:rubber
Dongguan, CN
InferredEngineering judgement, not measured. Low confidence.No evidence listed.
Silicone dome sheet
Authorised distributor for silicon
InferredEngineering judgement, not measured. Low confidence.No evidence listed.

sup:chip-distributor
Shenzhen, CN
InferredEngineering judgement, not measured. Low confidence.No evidence listed.
Bluetooth LE SoC, 7 x 7 mm QFN, 6-axis IMU, 3 x 3 mm LGA, Charger and power IC, 4 x 4 mm QFN, USB-C receptacle, mid-mount, 2.4 GHz chip antenna, 32 MHz crystal, Passives kit, about 120 parts
Packaging and accessories
InferredEngineering judgement, not measured. Low confidence.No evidence listed.

sup:pack
Dongguan, CN
InferredEngineering judgement, not measured. Low confidence.No evidence listed.
Retail box, Pulp tray, USB-C to USB-A cable, 1 m, Rating label