benikigai/ec-1Public
EC-1 Wireless Controller
SHA-256 10855ae925e673c2731fdbf65d64b3dcfc14b701253ed6b4388cf176f977733b
# SYNTHETIC.
part:top-shell:
material: PC/ABS, charcoal, light texture
process: injection-moulded, 2-cavity tool
part:bottom-shell:
material: PC/ABS, charcoal
process: injection-moulded, 2-cavity tool
part:button-cap:
material: ABS, off-white, pad-printed legend
process: injection-moulded, 8-cavity family tool
part:shoulder-button:
material: PC, charcoal
process: injection-moulded
part:dome-sheet:
material: silicone rubber, 50 Shore A
process: compression-moulded
part:stick-module:
material: 'mixed: POM shaft, ABS cap, carbon-track potentiometers'
process: purchased-assembly
part:main-pcba:
material: FR-4, 4 layers, 1.0 mm, ENIG
process: smt-assembled, both sides reflowed at the EMS
part:battery:
material: lithium-ion polymer
process: purchased-assembly with protection board
part:haptic-lra:
material: mixed
process: purchased-assembly
part:screw-m2x6:
material: steel, black zinc
process: cold-headed, thread-rolled
part:light-pipe:
material: PC, clear
process: injection-moulded
part:rating-label:
material: PET film, printed
process: die-cut, purchased
part:soc:
material: silicon die in QFN-48
process: purchased-component
part:imu:
material: MEMS in LGA-14
process: purchased-component
part:pmic:
material: silicon die in QFN-24
process: purchased-component
part:usb-c:
material: LCP body, gold-plated contacts
process: purchased-component
part:antenna:
material: ceramic
process: purchased-component
part:crystal:
material: quartz in ceramic package
process: purchased-component
part:passives:
material: MLCC, thick-film resistors, ferrites
process: purchased-component
part:pcb:
material: FR-4, Tg 150
process: fabricated board
part:retail-box:
material: SBS board, 350 gsm, matte laminate
process: printed, die-cut, glued
part:pack-tray:
material: moulded pulp
process: wet-pressed pulp
part:usb-cable:
material: TPE jacket, copper
process: purchased-assembly